Heat-dissipating device

ABSTRACT

A heat-dissipating device includes a housing having a housing wall that defines an inner space and that is formed with first and second openings. A heat source is disposed inside the inner space. A heat-conductive set is in heat-communication with the heat source inside the inner space. A heat-exchange member is in heat-communication with fins of the heat-conductive set, and includes an inner tunnel that extends from the first opening to the second opening through the inner space so as to open to ambient air. The inner tunnel is free of fluid communication with the inner space, and ambient air can flow through the inner tunnel for heat exchange.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority of Taiwanese application no. 097128107,filed on Jul. 24, 2008.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The invention relates to a heat-dissipating device, more particularly toa heat-dissipating device that achieves a heat-dissipating effect withregard to a heat source in a closed space.

2. Description of the Related Art

In general, to achieve a heat-dissipating effect in an electronicapparatus comprising a housing, heat-dissipating holes are formed insaid housing for heat dissipation, as disclosed in Taiwanese PatentPublication Number M329146. In another conventional embodiment, thehousing is directly made of a heat-conductive metal material to enableheat exchange between the heat source and cool air in the ambience, asdisclosed in Taiwanese Patent Number 557119.

However, since the aforementioned housing formed with holes for heatdissipation does not provide effects in waterproofing,moisture-proofing, dust-proofing, etc., electronic components in theelectronic apparatus are prone to damage and the service lives thereofare short. Such a heat-dissipating mechanism is therefore not suitablefor industrial or high-precision electronic apparatus. On the otherhand, the aforementioned housing directly made of heat-conductive metalmaterial provides effects in waterproofing, moisture-proofing,dust-proofing, etc. Nevertheless, since the electronic components aremounted in the housing, the heat-dissipating effect is poor and themanufacturing costs are relatively high. In particular, when the heatsource is a plurality of high-power light-emitting diodes, accumulationof too much heat energy easily forms a storing space for the heat energyin the housing, which, in the long term, adversely affectsfunctionalities of the electronic components and hence significantlyreduces service lives of the electronic components.

SUMMARY OF THE INVENTION

Therefore, the object of the present invention is to provide aheat-dissipating device that improves the heat-dissipating efficiencyand provides waterproofing, moisture-proofing and dust-proofing effects.

Accordingly, a heat-dissipating device of the present inventioncomprises a housing, a heat source, a heat-conductive set and aheat-exchange member.

The housing includes a housing wall that defines an inner space and thathas first and second openings.

The heat source, the heat-conductive set and the heat-exchange memberare disposed inside the inner space. The heat-conductive set is inheat-communication with the heat source, and the heat-exchange member isin heat-communication with the heat-conductive set.

The heat-exchange member includes an inner tunnel that extends from thefirst opening to the second opening of the housing through the innerspace so as to be open to ambient air. The inner tunnel is free of fluidcommunication with the inner space.

In a preferred embodiment, the heat-conductive set includes aheat-conductive component in heat-communication with the heat source,and a heat-dissipating component mounted between the heat-conductivecomponent and the heat-exchange member.

The heat-conductive set further includes a base seat disposed betweenthe heat source and the heat-conductive component. According to oneembodiment, the heat-conductive component and the heat source areconnected to opposite sides of the base seat.

The heat-conductive component is one of a solid-column, a U-shape plate,a hollow tube and a heat tube, and the heat-dissipating componentincludes a plurality of heat-dissipating parallel fins connected to theheat-conductive component.

According to one aspect of the invention, the heat-exchange memberfurther includes a tubular member that confines the inner tunnel andthat has opposite first and second ends sealed off from fluidcommunication with the inner space. The heat-conductive set includes aplurality of heat-dissipating parallel fins in contact with andtransverse to the tubular member. Preferably, the tubular memberpenetrates the fin plates.

In a preferred embodiment, the heat-exchange member further includes afirst sealing cap and a second sealing cap. The first and second sealingcaps are sealingly connected between the first end of the tubular memberand the first opening of the housing, and between the second end of thetubular member and the second opening of the housing, respectively.

Preferably, the first and second sealing caps are made of a rubbermaterial.

According to an aspect of the invention, the housing includes atransparent portion in front of the heat source.

The effect of this invention is to generate a stack effect throughimplementation of the heat-exchange member, such that heat energy istransferred to the cool air of the ambience, thereby increasing theheat-dissipating efficiency.

BRIEF DESCRIPTION OF THE DRAWINGS

Other features and advantages of the present invention will becomeapparent in the following detailed description of the preferredembodiment with reference to the accompanying drawings, of which:

FIG. 1 is a perspective view of the preferred embodiment of aheat-dissipating device according to the present invention;

FIG. 2 is a sectional view of the preferred embodiment; and

FIG. 3 is a bottom view of the preferred embodiment.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

Referring to FIGS. 1 to 3, the preferred embodiment of aheat-dissipating device according to the present invention is shown tobe adapted to a LED (light-emitting diode) lighting module 1 thatcomprises a plurality of LED units 11. The heat-dissipating deviceincludes a housing 2, and a plurality of heat-exchange members 3 in heatcommunication with a heat-conductive set 4 which in turn is in heatcommunication with the LED lighting module.

The housing 2 includes a housing wall 21 that confines a closed innerspace 20, and that is formed with a plurality of first openings 22 and aplurality of second openings 23 therethrough. The first openings 22 areprovided in an upper portion of the housing wall 21, and the secondopenings 23 are provided in a lower portion of the housing wall 21.

The housing wall 21 includes a non-transparent portion 211 and atransparent portion 212. The transparent portion 212 is disposed infront of the light-emitting module 1.

Each of the heat-exchange members 3 includes a tubular member 34surrounding an axis and confining the inner tunnel 33 that extends fromone of the first openings 22 to one of the second openings 23, and afirst sealing cap 31 and a second sealing cap 32 fixedly mounted on thetubular member 34. In this embodiment, the first and second sealing caps31, 32 are made of a rubber material and have end orifices 311, 321connecting the respective inner tunnels 33 to the ambience. The firstand second sealing cap 31,32 sealingly connect the tubular members 34 tothe housing wall 21 at the respective first and second openings 22, 23so that the tubular members 34 are sealed off from fluid communicationwith the inner space 20. Therefore, the inner tunnels 33 communicatewith the ambience through the end orifices 311, 321, but are free offluid communication with the inner space 20.

The heat-conductive set 4 includes a base seat 41, a plurality ofheat-conductive components 42, and a plurality of heat-dissipatingcomponents 43. The base seat 41 is disposed between the heat-conductivecomponents 42 and the LED units 11. More precisely, the heat-conductivecomponents 42 and the LED units 11 are connected to opposite sides ofthe base seat 41, and are enclosed in the inner space 20 of the housing2.

In this embodiment, each of the heat-conductive components is a U-shapedplate. Alternatively, each of the heat-conductive components 42 can beone of a solid column, a hollow tube and a heat tube. Theheat-dissipating components 43 are heat-dissipating parallel finsconnected transversely to the heat-conductive components 42 and thetubular members 34.

Preferably, the heat-dissipating components or parallel fins 43 are incontact with and are penetrated by the tubular members 34 for improvingheat exchange therebetween.

In operation, the preferred embodiment of a heat-dissipating deviceaccording to the present invention carries out the following steps:

Step 51: Heat energy is generated by the LED units 11 and conducted tothe heat-conductive components 42 through the base seat 41.

Step 52: The heat-conductive components 42 conduct the heat energy tothe inner space 20 of the housing 2 and transfers heat to the tubularmembers 34 of the heat-exchange members 3 via the heat-dissipatingcomponents 43.

Step 3: Each of the heat-exchange member 3 generates a stack effectaccording to the principle that hot air rises so that the hot air insidethe inner tunnel 33 rises and escapes from the end orifice 311 of thetop sealing cap 31 while cool air adjacent to the end orifice 321 of thebottom sealing cap 32 is drawn into the inner tunnel 33 through the endorifice 321. In such a manner, the tubular member 34 exchanges heat withthe cool air of the ambience to achieve the heat-dissipating effect.

Aside from dissipating heat, the housing 2 also provides effects inwaterproofing, moisture-proofing and dust-proofing. Since the materialof the housing 2 need not be limited, the manufacturing costs thereofcan be lowered, and the manufacturing process can be simplified, therebyenhancing practical use.

While the present invention has been described in connection with whatis considered the most practical and preferred embodiment, it isunderstood that this invention is not limited to the disclosedembodiment but is intended to cover various arrangements included withinthe spirit and scope of the broadest interpretation so as to encompassall such modifications and equivalent arrangements.

1. A heat-dissipating device, comprising: a housing including a housingwall that defines an inner space, and that has first and secondopenings; a heat source disposed inside said inner space; aheat-conductive set disposed inside said inner space and inheat-communication with said heat source; and a heat-exchange member inheat-communication with said heat-conductive set, said heat-exchangemember including an inner tunnel that extends from said first opening tosaid second opening of said housing through said inner space so as toopen to ambient air.
 2. The heat-dissipating device of claim 1, whereinsaid inner tunnel is free of fluid communication with said inner space.3. The heat-dissipating device of claim 1, wherein said heat-conductiveset includes: a heat-conductive component in heat-communication withsaid heat source; and a heat-dissipating component mounted between saidheat-conductive component and said heat-exchange member.
 4. Theheat-dissipating device of claim 3, wherein said heat-conductive setfurther includes a base seat disposed between said heat source and saidheat-conductive component.
 5. The heat-dissipating device of claim 4,wherein said heat-conductive component and said heat source areconnected to opposite sides of said base seat.
 6. The heat-dissipatingdevice of claim 3, wherein said heat-conductive component is one of asolid-column, a U-shaped plate, a hollow tube and a heat tube.
 7. Theheat-dissipating device of claim 5, wherein said heat-dissipatingcomponent includes a plurality of heat-dissipating parallel finsconnected transversely to said heat-conductive component.
 8. Theheat-dissipating device of claim 7, wherein said heat-exchange memberfurther includes a tubular member that confines said inner tunnel andthat has opposite first and second ends sealed off from fluidcommunication with said inner space.
 9. The heat-dissipating device ofclaim 8, wherein said heat-conductive set includes a plurality ofheat-dissipating parallel fins in contact with and transverse to saidtubular member.
 10. The heat-dissipating device of claim 9, wherein saidtubular member penetrates said fins.
 11. The heat-dissipating device ofclaim 9, wherein said heat-exchange member further includes a firstsealing cap and a second sealing cap, said first and second sealing capsbeing sealingly connected between said first end of said tubular memberand said first opening of said housing, and between said second end ofsaid tubular member and said second opening of said housing,respectively.
 12. The heat-dissipating device of claim 11, wherein saidfirst and second sealing caps are made of a rubber material.
 13. Theheat-dissipating device of claim 1, wherein said housing includes atransparent portion in front of said heat source.
 14. Theheat-dissipating device of claim 1, wherein said housing wall includesan upper portion and a lower portion below said upper portion, saidfirst and second openings being disposed in said upper and lowerportions, respectively.